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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM (words) | Clock Frequency | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MCF5253CVM140J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF525x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5253vm140j-datasheets-1935.pdf | 225-LFBGA | MCF5253 | External | DMA, WDT | 128K x 8 | 140MHz | Coldfire V2 | 1.08V~1.32V | ROMless | 32-Bit | CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG | A/D 6x12b | ||||||||||||||||||||||||||||||||||||||||
| MCF51MM256CML | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51MM | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 104-LFBGA | MCF51MM256 | External | 69 | LVD, PWM, WDT | 32K x 8 | 50MHz | Coldfire V1 | 1.8V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG | A/D 8x16b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||
| S9S08DN48F1MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08dn48f2mlf-datasheets-0465.pdf | 48-LQFP | S9S08DN48 | Internal | 39 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 48KB 48K x 8 | I2C, LINbus, SCI, SPI | A/D 16x12b | 1.5K x 8 | |||||||||||||||||||||||||||||||||||||||
| MC9S08JE128VMB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.52mm | ROHS3 Compliant | 2014 | 81-LBGA | 10mm | 10mm | 81 | 8542.31.00.01 | YES | BOTTOM | BALL | 3V | 1mm | MC9S08JE128 | 3.6V | 1.8V | S-PBGA-B81 | Internal | 47 | LVD, POR, PWM, WDT | 12K x 8 | 48MHz | MICROCONTROLLER | 8 | YES | NO | YES | YES | 16MHz | 1.8V~3.6V | FLASH | 8-Bit | 128KB 128K x 8 | I2C, SCI, SPI, USB | A/D 8x12b | |||||||||||||||||||
| MCF5282CVF80J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF528x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5282cvm80-datasheets-1857.pdf | 256-LBGA | MCF5282 | 256-MAPBGA (17x17) | External | 150 | DMA, LVD, POR, PWM, WDT | 64K x 8 | 80MHz | Coldfire V2 | 2.7V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | A/D 8x10b | |||||||||||||||||||||||||||||||||||||
| MCF5235CVF150 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF523x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5233cvm150-datasheets-2974.pdf | 256-LBGA | MCF5235 | External | 113 | DMA, WDT | 64K x 8 | 150MHz | Coldfire V2 | 1.4V~1.6V | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | ||||||||||||||||||||||||||||||||||||||||
| MCF5281CVM66J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF528x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5282cvm80-datasheets-1857.pdf | 256-LBGA | MCF5281 | External | 150 | DMA, LVD, POR, PWM, WDT | 64K x 8 | 66MHz | Coldfire V2 | 2.7V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||
| MCF5282CVF66J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF528x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5282cvm80-datasheets-1857.pdf | 256-LBGA | MCF5282 | 256-MAPBGA (17x17) | External | 150 | DMA, LVD, POR, PWM, WDT | 64K x 8 | 66MHz | Coldfire V2 | 2.7V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | A/D 8x10b | |||||||||||||||||||||||||||||||||||||
| MC9S08MM32ACLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | 64-LQFP | 10mm | 10mm | 64 | 8542.31.00.01 | YES | QUAD | GULL WING | 3V | 0.5mm | MC9S08MM32 | 3.6V | 1.8V | Not Qualified | S-PQFP-G64 | Internal | 33 | LVD, POR, PWM, WDT | 2K x 8 | 48MHz | MICROCONTROLLER | 8 | YES | NO | YES | YES | 16MHz | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | A/D 6x16b; D/A 1x12b | ||||||||||||||||||
| PCF51AC256BCFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AC | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf51ac128acfue-datasheets-5098.pdf | 64-QFP | PCF51AC256 | 64-QFP (14x14) | External | 54 | LVD, PWM, WDT | 32K x 8 | 50MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SCI, SPI | A/D 20x12b | |||||||||||||||||||||||||||||||||||||
| MC9S08MM128VMB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.52mm | ROHS3 Compliant | 2010 | 81-LBGA | 10mm | 10mm | 81 | unknown | 8542.31.00.01 | YES | BOTTOM | BALL | 3V | 1mm | MC9S08MM128 | 3.6V | 1.8V | Not Qualified | S-PBGA-B81 | Internal | 47 | LVD, POR, PWM, WDT | 12K x 8 | 48MHz | MICROCONTROLLER | 8 | YES | NO | YES | YES | 16MHz | 1.8V~3.6V | FLASH | 8-Bit | 128KB 128K x 8 | I2C, SCI, SPI, USB | A/D 8x16b; D/A 1x12b | |||||||||||||||||
| SC68376BGVAB20 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | SC68376 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 20MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | |||||||||||||||||||||||||||||||||||||||
| MCF5282CVM80J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF528x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5282cvm80-datasheets-1857.pdf | 256-LBGA | MCF5282 | 256-MAPBGA (17x17) | External | 150 | DMA, LVD, POR, PWM, WDT | 64K x 8 | 80MHz | Coldfire V2 | 2.7V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | A/D 8x10b | |||||||||||||||||||||||||||||||||||||
| MCF5233CVM150J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF523x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5233cvm150-datasheets-2974.pdf | 256-LBGA | MCF5233 | 256-MAPBGA (17x17) | External | 97 | DMA, WDT | 64K x 8 | 150MHz | Coldfire V2 | 1.4V~1.6V | ROMless | 32-Bit | CANbus, EBI/EMI, I2C, SPI, UART/USART | |||||||||||||||||||||||||||||||||||||||
| MCF5270CVM150J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF527x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5270vm100-datasheets-7182.pdf | 196-LBGA | MCF5270 | External | 97 | DMA, WDT | 64K x 8 | 150MHz | Coldfire V2 | 1.4V~1.6V | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART | ||||||||||||||||||||||||||||||||||||||||
| P89LPC970FDH,129 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89lpc970fdh129-datasheets-2047.pdf | 20-TSSOP (0.173, 4.40mm Width) | 20 | e3 | MATTE TIN | YES | DUAL | GULL WING | 225 | 0.635mm | P89LPC97* | 20 | NOT SPECIFIED | Microcontrollers | 3/5V | 12mA | Not Qualified | R-PDSO-G20 | Internal | 18 | Brown-out Detect/Reset, POR, PWM, WDT | 256 x 8 | 18MHz | 8 | 2048 | 8051 | 2.4V~5.5V | FLASH | 8-Bit | 2KB 2K x 8 | I2C, SPI, UART/USART | |||||||||||||||||||||
| MCF5373LCVM240J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF537x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5372lcvm240-datasheets-8772.pdf | 196-LBGA | MCF5373L | External | 62 | DMA, POR, PWM, WDT | 32K x 8 | 240MHz | Coldfire V3 | 1.4V~3.6V | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG | ||||||||||||||||||||||||||||||||||||||||
| P89LPC972FDH,129 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89lpc970fdh129-datasheets-2047.pdf | 20-TSSOP (0.173, 4.40mm Width) | 20 | e3 | MATTE TIN | YES | DUAL | GULL WING | 225 | 0.635mm | P89LPC97* | 20 | NOT SPECIFIED | Microcontrollers | 3/5V | 12mA | Not Qualified | R-PDSO-G20 | Internal | 18 | Brown-out Detect/Reset, POR, PWM, WDT | 256 x 8 | 18MHz | 8 | 8192 | 8051 | 2.4V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | |||||||||||||||||||||
| P89LPC971FDH,129 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89lpc970fdh129-datasheets-2047.pdf | 20-TSSOP (0.173, 4.40mm Width) | 20 | e3 | MATTE TIN | YES | DUAL | GULL WING | 225 | 0.635mm | P89LPC97* | 20 | NOT SPECIFIED | Microcontrollers | 3/5V | 12mA | Not Qualified | R-PDSO-G20 | Internal | 18 | Brown-out Detect/Reset, POR, PWM, WDT | 256 x 8 | 18MHz | 8 | 4096 | 8051 | 2.4V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SPI, UART/USART | |||||||||||||||||||||
| PCF51AC256BCPUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AC | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf51ac128acfue-datasheets-5098.pdf | 64-LQFP | PCF51AC256 | External | 54 | LVD, PWM, WDT | 32K x 8 | 50MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SCI, SPI | A/D 20x12b | ||||||||||||||||||||||||||||||||||||||
| PK30X128VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K30 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | 144-LBGA | PK30X128 | Internal | 102 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 31x16b; D/A 2x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||
| PK10X256VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 144-LQFP | PK10X256 | Internal | 104 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 37x16b; D/A 2x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||
| PK10X256VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 144-LBGA | PK10X256 | Internal | 104 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 37x16b; D/A 2x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||
| PPC5606BCLU64 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | 176-LQFP | PC5606 | 176-LQFP (24x24) | Internal | 149 | DMA, POR, PWM, WDT | 80K x 8 | 64MHz | e200z0h | 3V~5.5V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 29x10b, 5x12b | 64K x 8 | |||||||||||||||||||||||||||||||||||||
| PK20N512VLK100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | 80-LQFP | PK20N512 | Internal | 52 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 33x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||
| MCF5272VF66J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF527x | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | Non-RoHS Compliant | 1992 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5272vm66-datasheets-5166.pdf | 196-LBGA | MCF5272 | 196-MAPBGA (15x15) | External | 32 | DMA, WDT | 1K x 32 | 66MHz | Coldfire V2 | 3V~3.6V | ROM | 32-Bit | 16KB 4K x 32 | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | ||||||||||||||||||||||||||||||||||||||
| P89LPC982FA,529 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89lpc982fa529-datasheets-2073.pdf | 28-LCC (J-Lead) | 28 | e3 | MATTE TIN | YES | QUAD | J BEND | 225 | 1.27mm | P89LPC98* | 28 | NOT SPECIFIED | Microcontrollers | 2.5/5V | 12mA | Not Qualified | S-PQCC-J28 | Internal | 26 | Brown-out Detect/Reset, POR, PWM, WDT | 512 x 8 | 18MHz | 8 | 8192 | 8051 | 2.4V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | |||||||||||||||||||||
| MB90F342CESPQC-GSE2 | Fujitsu Electronics America, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | F2MC MB90340E | Surface Mount | -40°C~105°C TA | Bag | 3 (168 Hours) | RoHS Compliant | 2015 | 100-LQFP | 8 Weeks | External | 82 | DMA, POR, WDT | 16K x 8 | 24MHz | F2MC-16LX | 3V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART | A/D 24x8/10b | |||||||||||||||||||||||||||||||||||||||
| P89LPC982FDH,529 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2000 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89lpc982fa529-datasheets-2073.pdf | 28-TSSOP (0.173, 4.40mm Width) | 28 | e3 | MATTE TIN | YES | DUAL | GULL WING | 225 | 0.635mm | P89LPC98* | 28 | NOT SPECIFIED | Microcontrollers | 2.5/5V | 12mA | Not Qualified | R-PDSO-G28 | Internal | 26 | Brown-out Detect/Reset, POR, PWM, WDT | 512 x 8 | 18MHz | 8 | 8192 | 8051 | 2.4V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | |||||||||||||||||||||
| PCF51AC128ACLKE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AC | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf51ac128acfue-datasheets-5098.pdf | 80-LQFP | PCF51AC128 | 80-LQFP (14x14) | External | 69 | LVD, PWM, WDT | 32K x 8 | 50MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | A/D 24x12b |
