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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | ROM (words) | Clock Frequency | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PK30X128VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K30 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 144-LQFP | PK30X128 | Internal | 102 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 31x16b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||
| PK30N512VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K30 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | 144-LBGA | PK30N512 | Internal | 102 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 31x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||
| PK20N512VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | 144-LQFP | PK20N512 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 33x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||
| PK10N512VLK100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 80-LQFP | PK10N512 | Internal | 56 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 27x16b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||||
| PK40N512VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K40 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 144-LQFP | PK40N512 | Internal | 98 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 27x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||
| PK20N512VLL100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Bulk | 3 (168 Hours) | ROHS3 Compliant | 2012 | 100-LQFP | PK20N512 | Internal | 66 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 25x16b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||||
| MCF52259CVN80J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5225x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2008 | 144-LBGA | MCF52259 | Internal | 96 | DMA, LVD, POR, PWM, WDT | 64K x 8 | 80MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG | A/D 8x12b | |||||||||||||||||||||||||||||||||||||||||
| S9S08DN60F1MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08dn48f2mlf-datasheets-0465.pdf | 48-LQFP | S9S08DN60 | 48-LQFP (7x7) | Internal | 39 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SCI, SPI | A/D 16x12b | 2K x 8 | |||||||||||||||||||||||||||||||||||||||
| PK20X128VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | 144-LBGA | PK20X128 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 32K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 33x16b; D/A 2x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||
| MCF5235CVM150J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF523x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5233cvm150-datasheets-2974.pdf | 256-LBGA | MCF5235 | 256-MAPBGA (17x17) | External | 97 | DMA, WDT | 64K x 8 | 150MHz | Coldfire V2 | 1.4V~1.6V | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | |||||||||||||||||||||||||||||||||||||||||
| MCF52258CVN66J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5225x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2008 | 144-LBGA | MCF52258 | Internal | 96 | DMA, LVD, POR, PWM, WDT | 64K x 8 | 66MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG | A/D 8x12b | |||||||||||||||||||||||||||||||||||||||||
| LPC3141FET180,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC3100 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc3143fet180551-datasheets-9730.pdf | 180-TFBGA | 12mm | 12mm | 180 | 12 Weeks | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | LPC314* | 180 | 1.3V | 1.1V | NOT SPECIFIED | Microcontrollers | 1.21.8/3.3V | Not Qualified | S-PBGA-B180 | External | 20 | DMA, I2S, LCD, PWM, WDT | 192K x 8 | 270MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | FLASH | 25MHz | ARM926EJ-S | 1.1V~3.6V | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | A/D 4x10b | |||||||||||
| EM773FHN33,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1mm | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/nxpusainc-em773fhn33551-datasheets-2234.pdf | 32-VQFN Exposed Pad | 7mm | 7mm | 33 | unknown | YES | QUAD | NO LEAD | 3.3V | 0.65mm | EM773 | 32 | 3.6V | 1.8V | S-PQCC-N33 | Internal | 25 | Brown-out Detect/Reset, POR, WDT | 8K x 8 | 48MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M0 | 1.8V~3.6V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | ||||||||||||||||||||||||||
| S9S08DZ48F1MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2008 | 32-LQFP | S9S08DZ48 | 32-LQFP (7x7) | External | 25 | LVD, POR, PWM, WDT | 3K x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 10x12b | 1.5K x 8 | |||||||||||||||||||||||||||||||||||||||
| MCF51AG96CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AG | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP | MCF51AG96 | Internal | 39 | DMA, LVD, PWM, WDT | 16K x 8 | 50MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 96KB 96K x 8 | SCI, SPI | A/D 12x12b | |||||||||||||||||||||||||||||||||||||||||
| S9S08DV32F1MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08dv16aclc-datasheets-3459.pdf | 32-LQFP | S9S08DV32 | External | 25 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 10x12b | |||||||||||||||||||||||||||||||||||||||||
| PK60N512VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 144-LBGA | PK60N512 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 27x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||
| MC9S08LL36CLK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08ll64clk-datasheets-8073.pdf | 80-LQFP | MC9S08LL36 | Internal | 39 | LCD, LVD, POR, PWM, WDT | 4K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 36KB 36K x 8 | I2C, SCI, SPI | A/D 10x12b | |||||||||||||||||||||||||||||||||||||||||
| PK30N512VLL100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K30 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 100-LQFP | PK30N512 | Internal | 66 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | A/D 24x16b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||||
| S9S08DZ16F1MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2008 | 32-LQFP | S9S08DZ16 | 32-LQFP (7x7) | External | 25 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 10x12b | 512 x 8 | |||||||||||||||||||||||||||||||||||||||
| PK10X128VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 144-LBGA | PK10X128 | Internal | 104 | DMA, I2S, LVD, POR, PWM, WDT | 32K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 37x16b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||
| MCF51MM256CMB | NXP USA Inc. | $10.97 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51MM | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 81-LBGA | MCF51MM256 | 81-MAPBGA (10x10) | External | 48 | LVD, PWM, WDT | 32K x 8 | 50MHz | Coldfire V1 | 1.8V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG | A/D 8x16b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||
| MC9S08AC8MBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~125°C TA | Tube | Not Applicable | CMOS | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08ac16cfje-datasheets-4300.pdf | 42-SDIP (0.600, 15.24mm) | 7mm | 7mm | 32 | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 3V | 0.8mm | MC9S08AC8 | 5.5V | 2.7V | NOT SPECIFIED | Internal | 32 | LVD, POR, PWM, WDT | 768 x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | 16MHz | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | A/D 8x10b | ||||||||||||||||||||
| PK10N512VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 144-LQFP | PK10N512 | Internal | 104 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 37x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||
| MC9S08JE128VLK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2011 | 80-LQFP | 12mm | 12mm | 80 | 8542.31.00.01 | YES | QUAD | GULL WING | 3V | 0.5mm | MC9S08JE128 | 3.6V | 1.8V | S-PQFP-G80 | Internal | 46 | LVD, POR, PWM, WDT | 12K x 8 | 48MHz | MICROCONTROLLER | 8 | YES | NO | YES | YES | 16MHz | 1.8V~3.6V | FLASH | 8-Bit | 128KB 128K x 8 | I2C, SCI, SPI, USB | A/D 8x12b | |||||||||||||||||||||
| MC9S08SH16VTG | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08sh16ctg-datasheets-5382.pdf | 16-TSSOP (0.173, 4.40mm Width) | MC9S08SH16 | Internal | 13 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||
| S9S08DN32F1MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08dn48f2mlf-datasheets-0465.pdf | 48-LQFP | S9S08DN32 | 48-LQFP (7x7) | Internal | 39 | LVD, POR, PWM, WDT | 1.5K x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | A/D 16x12b | 1K x 8 | |||||||||||||||||||||||||||||||||||||||
| P89LPC980FDH,529 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89lpc982fa529-datasheets-2073.pdf | 28-TSSOP (0.173, 4.40mm Width) | 28 | e3 | MATTE TIN | YES | DUAL | GULL WING | 225 | 0.635mm | P89LPC98* | 28 | NOT SPECIFIED | Microcontrollers | 2.5/5V | 12mA | Not Qualified | R-PDSO-G28 | Internal | 26 | Brown-out Detect/Reset, POR, PWM, WDT | 256 x 8 | 18MHz | 8 | 4096 | 8051 | 2.4V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SPI, UART/USART | |||||||||||||||||||||||
| MCF5253CVM140J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF525x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5253vm140j-datasheets-1935.pdf | 225-LFBGA | MCF5253 | External | DMA, WDT | 128K x 8 | 140MHz | Coldfire V2 | 1.08V~1.32V | ROMless | 32-Bit | CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG | A/D 6x12b | ||||||||||||||||||||||||||||||||||||||||||
| MCF51MM256CML | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51MM | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 104-LFBGA | MCF51MM256 | External | 69 | LVD, PWM, WDT | 32K x 8 | 50MHz | Coldfire V1 | 1.8V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG | A/D 8x16b; D/A 1x12b |
