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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | CPU Family | ROM (words) | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| S9S08DN32F1MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08dn48f2mlf-datasheets-0465.pdf | 32-LQFP | S9S08DN32 | 32-LQFP (7x7) | Internal | 25 | LVD, POR, PWM, WDT | 1.5K x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | A/D 10x12b | 1K x 8 | |||||||||||||||||||||||||||||||||||||||||
| SPC5517GAMMG66 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC55xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-spc5517ebmlq66-datasheets-3415.pdf | 208-BGA | SPC5517 | Internal | 144 | DMA, POR, PWM, WDT | 80K x 8 | 66MHz | e200z0, e200z1 | 4.5V~5.25V | FLASH | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | A/D 40x12b | ||||||||||||||||||||||||||||||||||||||||||
| PK30N512VLK100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K30 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 80-LQFP | PK30N512 | Internal | 56 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | A/D 22x16b; D/A 1x12b | ||||||||||||||||||||||||||||||||||||||||||||
| MCF51AG96CLK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AG | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 80-LQFP | MCF51AG96 | Internal | 69 | DMA, LVD, PWM, WDT | 16K x 8 | 50MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 96KB 96K x 8 | I2C, SCI, SPI | A/D 24x12b | |||||||||||||||||||||||||||||||||||||||||||
| S912XHZ512F1CAL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xhz256vagr-datasheets-1462.pdf | 112-LQFP | 20mm | 20mm | 112 | 22 Weeks | YES | QUAD | GULL WING | 5V | 0.65mm | S912XHZ512 | 5.5V | 4.5V | Microcontrollers | 2.55V | 110mA | Not Qualified | S-PQFP-G112 | AEC-Q100 | External | 85 | LCD, Motor control PWM, POR, PWM, WDT | 32K x 8 | 80MHz | MICROCONTROLLER, RISC | 16 | YES | YES | YES | CPU12 | 524288 | 40MHz | 23 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | A/D 16x8/10b | 4K x 8 | ||||||||||||||
| MCF51AG128VLK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AG | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | 80-LQFP | 14mm | 14mm | 80 | 8542.31.00.01 | YES | QUAD | GULL WING | 3V | 0.65mm | MCF51AG128 | 5.5V | 2.7V | S-PQFP-G80 | Internal | 69 | DMA, LVD, PWM, WDT | 16K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 16MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SCI, SPI | A/D 24x12b | ||||||||||||||||||||||
| MCF51MM256VMB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51MM | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 81-LBGA | MCF51MM256 | 81-MAPBGA (10x10) | External | 48 | LVD, PWM, WDT | 32K x 8 | 50MHz | Coldfire V1 | 1.8V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG | A/D 8x16b; D/A 1x12b | ||||||||||||||||||||||||||||||||||||||||||
| PK30X256VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K30 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 144-LQFP | PK30X256 | Internal | 102 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 31x16b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||
| MCF5214CVF66J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF521x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5282cvm80-datasheets-1857.pdf | 256-LBGA | MCF5214 | 256-MAPBGA (17x17) | Internal | 142 | DMA, LVD, POR, PWM, WDT | 64K x 8 | 66MHz | Coldfire V2 | 2.7V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SPI, UART/USART | A/D 8x12b | |||||||||||||||||||||||||||||||||||||||||
| MCF51AG128VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AG | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | 48-LQFP | 7mm | 7mm | 48 | 8542.31.00.01 | YES | QUAD | GULL WING | 3V | 0.5mm | MCF51AG128 | 5.5V | 2.7V | S-PQFP-G48 | Internal | 39 | DMA, LVD, PWM, WDT | 16K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 16MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 128KB 128K x 8 | SCI, SPI | A/D 12x12b | ||||||||||||||||||||||
| PK40X128VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K40 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 144-LBGA | PK40X128 | Internal | 98 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 27x16b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||
| MCF51JE256CML | NXP USA Inc. | $10.33 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51JE | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2012 | 104-LFBGA | 8542.31.00.01 | MCF51JE256 | External | 69 | LVD, PWM, WDT | 32K x 8 | 50MHz | MICROCONTROLLER | Coldfire V1 | 1.8V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG | A/D 12x12b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||
| PK40X256VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K40 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | 144-LBGA | PK40X256 | Internal | 98 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 27x16b; D/A 2x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||
| PK40X256VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K40 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | 144-LQFP | PK40X256 | Internal | 98 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 27x16b; D/A 2x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||
| S912XEQ384J3CAL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2013 | 112-LQFP | 20mm | 20mm | 112 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 1.8V | 0.65mm | S912XEQ384 | 1.98V | 1.72V | 40 | Microcontrollers | 3.3/5V | Not Qualified | S-PQFP-G112 | External | 91 | LVD, POR, PWM, WDT | 24K x 8 | 50MHz | MICROCONTROLLER, RISC | 16 | YES | YES | YES | CPU12 | 393216 | 16MHz | 23 | 16 | 1.72V~5.5V | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | A/D 16x12b | 4K x 8 | |||||||||||||
| LPC3152FET208,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC3100 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.15mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc3154fet208551-datasheets-1989.pdf | 208-TFBGA | 12mm | 12mm | 208 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 1.2V | 0.65mm | LPC315* | 208 | 1.3V | 1.1V | Microcontrollers | 1.21.8/3.3V | Not Qualified | S-PBGA-B208 | External | 10 | DMA, I2S, LCD, PWM, WDT | 192K x 8 | 180MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | FLASH | 25MHz | ARM9® | 1.1V~3.6V | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | A/D 3x10b | ||||||||||||||||
| PK40N512VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K40 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | 144-LBGA | PK40N512 | Internal | 98 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 27x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||
| PK10N512VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 144-LBGA | PK10N512 | Internal | 104 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 37x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||
| PK10X128VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 144-LQFP | PK10X128 | Internal | 104 | DMA, I2S, LVD, POR, PWM, WDT | 32K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 37x16b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||
| S9S08DV16F1MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08dv16aclc-datasheets-3459.pdf | 32-LQFP | S9S08DV16 | External | 25 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 10x12b | ||||||||||||||||||||||||||||||||||||||||||||
| PK20X256VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | 144-LQFP | PK20X256 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 33x16b; D/A 2x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||
| PK40N512VLL100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K40 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | 100-LQFP | PK40N512 | Internal | 64 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 20x16b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||||||
| MCF5280CVM80J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF528x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5282cvm80-datasheets-1857.pdf | 256-LBGA | MCF5280 | External | 150 | DMA, LVD, POR, PWM, WDT | 64K x 8 | 80MHz | Coldfire V2 | 2.7V~3.6V | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||||
| LPC2103FHN48H/6,51 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC2100 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc2103fbd48118-datasheets-0996.pdf | 48-VFQFN Exposed Pad | LPC2103 | 48-HVQFN (6x6) | Internal | 32 | POR, PWM, WDT | 8K x 8 | 70MHz | ARM7® | 1.65V~3.6V | FLASH | 16/32-Bit | 32KB 32K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| S9S08SG32E1WTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08sg32e1mtg-datasheets-0710.pdf | 16-TSSOP (0.173, 4.40mm Width) | S9S08SG32 | Internal | 12 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | A/D 16x10b | |||||||||||||||||||||||||||||||||||||||||||
| MCF53281CVM240J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF532x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5328cvm240-datasheets-8665.pdf | 256-LBGA | MCF53281 | External | 94 | DMA, LCD, PWM, WDT | 32K x 8 | 240MHz | Coldfire V3 | 1.4V~3.6V | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||
| PK30N512VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K30 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 144-LQFP | PK30N512 | Internal | 102 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 31x16b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||
| MC9S08MM32VLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | 64-LQFP | 10mm | 10mm | 64 | 8542.31.00.01 | YES | QUAD | GULL WING | 3V | 0.5mm | MC9S08MM32 | 3.6V | 1.8V | Not Qualified | S-PQFP-G64 | Internal | 33 | LVD, POR, PWM, WDT | 4K x 8 | 48MHz | MICROCONTROLLER | 8 | YES | NO | YES | YES | 16MHz | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI, USB | A/D 6x16b; D/A 1x12b | ||||||||||||||||||||||
| MCF51MM256VML | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51MM | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 104-LFBGA | MCF51MM256 | External | 69 | LVD, PWM, WDT | 32K x 8 | 50MHz | Coldfire V1 | 1.8V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG | A/D 8x16b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||||||
| PK10X128VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 144-LBGA | PK10X128 | Internal | 104 | DMA, I2S, LVD, POR, PWM, WDT | 32K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 37x16b; D/A 2x12b | 4K x 8 |
