Specialized ICs(2368)

Name	Manufacturer	Pricing(USD)	Quantity	Size(LxWxH)	Part Status	Type	Mount	Packaging	Moisture Sensitivity Level (MSL)	Max Operating Temperature	Min Operating Temperature	Voltage - Rated	Technology	Frequency	Operating Mode	Height Seated (Max)	RoHS Status	Published	Datasheet	Package / Case	Length	Height	Width	Operating Supply Voltage	Lead Free	Number of Terminations	Factory Lead Time	Weight	REACH SVHC	Max Supply Voltage	Min Supply Voltage	Number of Pins	Density	Pbfree Code	Thickness	ECCN Code	Additional Feature	Contact Plating	Radiation Hardening	Reach Compliance Code	HTS Code	Number of Functions	Nominal Supply Current	JESD-609 Code	Terminal Finish	Surface Mount	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Pin Count	Temperature Grade	Telecom IC Type	Operating Temperature (Max)	Operating Temperature (Min)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Analog IC - Other Type	Element Configuration	Time@Peak Reflow Temperature-Max (s)	Subcategory	Power Supplies	Supply Current-Max	Qualification Status	Frequency (Max)	Direction	Access Time	Clock Frequency	Organization	Memory Width	Memory Density	Parallel/Serial	Alternate Memory Width	Standby Current-Max	Word Size	Access Time (Max)	Sync/Async	Memory IC Type	Output Enable	Bus Directional	Retransmit Capability	FWFT Support	Programmable Flags Support	Voltage - Clamping	Cycle Time	Current - Input
IDT72P51369L5BB	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)				CMOS		ASYNCHRONOUS		RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51369l5bb-datasheets-7087.pdf	BGA						256						256												e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		COMMERCIAL		70°C							FIFOs	1.8V	0.15mA	Not Qualified				200MHz	128KX36	36	4718592 bit			0.1A		3.6 ns		OTHER FIFO
IDT72P51359L6BBI8	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount	Tape & Reel (TR)	3 (168 Hours)				CMOS		ASYNCHRONOUS		Non-RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51359l6bbi8-datasheets-6970.pdf	BGA						256						256								not_compliant				e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		INDUSTRIAL		85°C	-40°C						FIFOs	1.8V	0.15mA	Not Qualified				166MHz	64KX36	36	2359296 bit			0.1A		3.7 ns		OTHER FIFO
IDT72P51359L6BBI	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)				CMOS		ASYNCHRONOUS		RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51359l6bbi-datasheets-6840.pdf	BGA						256						256												e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		INDUSTRIAL		85°C	-40°C						FIFOs	1.8V	0.15mA	Not Qualified				166MHz	64KX36	36	2359296 bit			0.1A		3.7 ns		OTHER FIFO
IDT72P51359L6BB8	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount	Tape & Reel (TR)	3 (168 Hours)				CMOS		SYNCHRONOUS	3.5mm	Non-RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51359l6bb8-datasheets-6735.pdf	BGA	17mm		17mm			256						256				EAR99				not_compliant	8542.32.00.71	1		e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm	256	COMMERCIAL		70°C		1.9V	1.7V				FIFOs	1.8V	0.15mA	Not Qualified				166MHz	64KX36	36	2359296 bit	PARALLEL		0.1A		3.7 ns		OTHER FIFO	YES						6 ns
IDT72P51359L6BB	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)				CMOS		ASYNCHRONOUS		RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51359l6bb-datasheets-6666.pdf	BGA						256						256												e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		COMMERCIAL		70°C							FIFOs	1.8V	0.15mA	Not Qualified				166MHz	64KX36	36	2359296 bit			0.1A		3.7 ns		OTHER FIFO
IDT72P51359L5BB8	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount	Tape & Reel (TR)	3 (168 Hours)				CMOS		SYNCHRONOUS	3.5mm	Non-RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51359l5bb8-datasheets-6552.pdf	BGA	17mm		17mm			256						256				EAR99				not_compliant	8542.32.00.71	1		e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm	256	COMMERCIAL		70°C		1.9V	1.7V				FIFOs	1.8V	0.15mA	Not Qualified				200MHz	64KX36	36	2359296 bit	PARALLEL		0.1A		3.6 ns		OTHER FIFO	YES						5 ns
IDT72P51359L5BB	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)				CMOS		ASYNCHRONOUS		Non-RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51359l5bb-datasheets-6414.pdf	BGA						256						256								not_compliant				e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		COMMERCIAL		70°C							FIFOs	1.8V	0.15mA	Not Qualified				200MHz	64KX36	36	2359296 bit			0.1A		3.6 ns		OTHER FIFO
IDT72P51349L6BBI8	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount	Tape & Reel (TR)	3 (168 Hours)				CMOS		ASYNCHRONOUS		RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51349l6bbi8-datasheets-6331.pdf	BGA						256						256												e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		INDUSTRIAL		85°C	-40°C						FIFOs	1.8V	0.15mA	Not Qualified				166MHz	32KX36	36	1179648 bit			0.1A		3.7 ns		OTHER FIFO
IDT72P51349L6BBI	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)				CMOS		ASYNCHRONOUS		Non-RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51349l6bbi-datasheets-6124.pdf	BGA						256						256								not_compliant				e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		INDUSTRIAL		85°C	-40°C						FIFOs	1.8V	0.15mA	Not Qualified				166MHz	32KX36	36	1179648 bit			0.1A		3.7 ns		OTHER FIFO
IDT72P51349L6BB8	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount	Tape & Reel (TR)	3 (168 Hours)				CMOS		SYNCHRONOUS	3.5mm	RoHS Compliant	2005	/files/integrateddevicetechnology-idt72p51349l6bb8-datasheets-6041.pdf	BGA	17mm		17mm			256						256				EAR99					8542.32.00.71	1		e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm	256	COMMERCIAL		70°C		1.9V	1.7V				FIFOs	1.8V	0.15mA	Not Qualified				166MHz	32KX36	36	1179648 bit	PARALLEL		0.1A		3.7 ns		OTHER FIFO	YES						6 ns
IDT72P51349L6BB	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)				CMOS		ASYNCHRONOUS		Non-RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51349l6bb-datasheets-5949.pdf	BGA						256						256								not_compliant				e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		COMMERCIAL		70°C							FIFOs	1.8V	0.15mA	Not Qualified				166MHz	32KX36	36	1179648 bit			0.1A		3.7 ns		OTHER FIFO
IDT72P51349L5BB8	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount	Tape & Reel (TR)	3 (168 Hours)				CMOS		SYNCHRONOUS	3.5mm	Non-RoHS Compliant	2005	/files/integrateddevicetechnology-idt72p51349l5bb8-datasheets-5838.pdf	BGA	17mm		17mm			256						256				EAR99				not_compliant	8542.32.00.71	1		e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm	256	COMMERCIAL		70°C		1.9V	1.7V				FIFOs	1.8V	0.15mA	Not Qualified				200MHz	32KX36	36	1179648 bit	PARALLEL		0.1A		3.6 ns		OTHER FIFO	YES						5 ns
IDT72P51349L5BB	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)				CMOS		ASYNCHRONOUS		Non-RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51349l5bb-datasheets-5769.pdf	BGA						256						256								not_compliant				e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		COMMERCIAL		70°C							FIFOs	1.8V	0.15mA	Not Qualified				200MHz	32KX36	36	1179648 bit			0.1A		3.6 ns		OTHER FIFO
IDT72P51339L6BBI8	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount	Tape & Reel (TR)	3 (168 Hours)				CMOS		ASYNCHRONOUS		RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51339l6bbi8-datasheets-5644.pdf	BGA						256						256												e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		INDUSTRIAL		85°C	-40°C						FIFOs	1.8V	0.15mA	Not Qualified				166MHz	16KX36	36	589824 bit			0.1A		3.7 ns		OTHER FIFO
IDT72P51339L6BBI	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)				CMOS		ASYNCHRONOUS		Non-RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51339l6bbi-datasheets-5569.pdf	BGA						256						256								not_compliant				e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		INDUSTRIAL		85°C	-40°C						FIFOs	1.8V	0.15mA	Not Qualified				166MHz	16KX36	36	589824 bit			0.1A		3.7 ns		OTHER FIFO
IDT72P51339L6BB8	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount	Tape & Reel (TR)	3 (168 Hours)				CMOS		SYNCHRONOUS	3.5mm	RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51339l6bb8-datasheets-5447.pdf	BGA	17mm		17mm			256						256				EAR99					8542.32.00.71	1		e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm	256	COMMERCIAL		70°C		1.9V	1.7V				FIFOs	1.8V	0.15mA	Not Qualified				166MHz	16KX36	36	589824 bit	PARALLEL		0.1A		3.7 ns		OTHER FIFO	YES						6 ns
IDT72P51339L6BB	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)				CMOS		ASYNCHRONOUS		Non-RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51339l6bb-datasheets-5352.pdf	BGA						256						256								not_compliant				e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		COMMERCIAL		70°C							FIFOs	1.8V	0.15mA	Not Qualified				166MHz	16KX36	36	589824 bit			0.1A		3.7 ns		OTHER FIFO
TSI572-10GIL	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0	download		Surface Mount		3 (168 Hours)								Non-RoHS Compliant	2011	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57210gil-datasheets-5344.pdf		21mm	1.81mm	21mm		Contains Lead	399						399		no	1.81mm	EAR99				not_compliant	8542.39.00.01	1		e0	Tin/Lead (Sn/Pb)		BOTTOM	BALL	225	1.2V		399	INDUSTRIAL	TELECOM CIRCUIT	85°C	-40°C					NOT SPECIFIED
TSI564A-10GILY	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		4 (72 Hours)							2.66mm	RoHS Compliant	2009	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi564a10gily-datasheets-5242.pdf	FCBGA	21mm		21mm		Contains Lead	399						399		no	2.3mm				No		8542.39.00.01	1		e1	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	BALL	260	3.3V		399	INDUSTRIAL	TELECOM CIRCUIT	85°C	-40°C
IDT72P51339L5BB8	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount	Tape & Reel (TR)	3 (168 Hours)				CMOS		SYNCHRONOUS	3.5mm	RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51339l5bb8-datasheets-5223.pdf	BGA	17mm		17mm			256						256				EAR99					8542.32.00.71	1		e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm	256	COMMERCIAL		70°C		1.9V	1.7V				FIFOs	1.8V	0.15mA	Not Qualified				200MHz	16KX36	36	589824 bit	PARALLEL		0.1A		3.6 ns		OTHER FIFO	YES						5 ns
IDT72P51339L5BB	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)				CMOS		ASYNCHRONOUS		RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51339l5bb-datasheets-5048.pdf	BGA						256						256												e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL		1.8V	1mm		COMMERCIAL		70°C							FIFOs	1.8V	0.15mA	Not Qualified				200MHz	16KX36	36	589824 bit			0.1A		3.6 ns		OTHER FIFO
72V51446L7-5BB	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0	download		Surface Mount			70°C	0°C						RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51446l75bb-datasheets-4731.pdf		17mm		17mm	3.3V	Contains Lead		7 Weeks			3.6V	3.15V	256			1.76mm			Lead, Tin																						Dual						133MHz															Unidirectional	No	Yes
80HCPS1616CHRI	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0	download				4 (72 Hours)								RoHS Compliant	2011	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1616chri-datasheets-2943.pdf	FCBGA	21mm	3.34mm	21mm		Contains Lead	400	18 Weeks					400		no	3.34mm	EAR99		Copper, Silver, Tin			8542.39.00.01	1		e1	Tin/Silver/Copper (Sn/Ag/Cu)	YES	BOTTOM	BALL	245	1V		400	INDUSTRIAL	TELECOM CIRCUIT	85°C	-40°C					NOT SPECIFIED	Other Telecom ICs	12.5/3.3V	4730mA	Not Qualified
X90100M8I	Intersil (Renesas Electronics America)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount	Bulk	5 (48 Hours)							1.1mm	Non-RoHS Compliant	2004	https://pdf.utmel.com/r/datasheets/intersil-x90100m8i-datasheets-2266.pdf	MSOP	3mm		3mm		Contains Lead	8						8										1		e3	MATTE TIN		DUAL	GULL WING	260	5V	0.65mm	8	INDUSTRIAL			-40°C	5.5V	2.7V	ANALOG CIRCUIT		40				Not Qualified
IDT72V51543L7-5BBI	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0			Surface Mount		3 (168 Hours)	85°C	-40°C		CMOS	133MHz		3.5mm	Non-RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72v51543l75bbi-datasheets-1250.pdf	BGA	17mm		17mm	3.3V		256				3.6V	3.15V	256	1 Mb			EAR99	ALTERNATIVE MEMORY WIDTH:9-BIT			not_compliant	8542.32.00.71	1	100mA	e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL	225	3.3V	1mm	256	INDUSTRIAL							Dual	20	FIFOs			Not Qualified		Unidirectional	4 ns		64KX18	18		PARALLEL	9	0.01A	18b		Synchronous	OTHER FIFO	YES						7.5 ns
72V51443L7-5BBI	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0	download		Surface Mount			85°C	-40°C			133MHz			RoHS Compliant	2005	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51443l75bbi-datasheets-0551.pdf	BGA	17mm		17mm	3.3V	Contains Lead		7 Weeks	1.724105g		3.6V	3.15V	256	1.1 Mb		1.76mm			Lead, Tin					100mA																	Dual						133MHz	Unidirectional	4 ns								18b		Synchronous			Unidirectional	No	Yes	Yes
TSI572-10GCLV	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0	download		Surface Mount		3 (168 Hours)							2mm	RoHS Compliant	2004	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57210gclv-datasheets-0456.pdf	BGA	21mm		21mm		Lead Free	399	10 Weeks					399		yes	1.81mm	EAR99					8542.39.00.01	1		e1	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	BALL	260	1.2V		399	COMMERCIAL	TELECOM CIRCUIT	70°C						NOT SPECIFIED
80HCPS1848HM	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0	download				4 (72 Hours)							2.83mm	RoHS Compliant	2011	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848hm-datasheets-0250.pdf	FCBGA	29mm		29mm		Contains Lead	784						784		no	2.75mm				No		8542.39.00.01	1		e0	Tin/Lead (Sn/Pb)	YES	BOTTOM	BALL	225	1V	1mm	784	COMMERCIAL	TELECOM CIRCUIT	70°C
TSI578-10GIL	Integrated Device Technology (IDT)		RFQ Min: 1 Mult: 1	0x0x0	download		Surface Mount		3 (168 Hours)							2.55mm	RoHS Compliant	2011	https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57810gil-datasheets-0026.pdf	FCBGA	27mm		27mm		Contains Lead	675	5 Weeks					675		no	2.41mm	EAR99			No		8542.39.00.01	1		e0	Tin/Lead (Sn63Pb37)		BOTTOM	BALL	225	3.3V		675	INDUSTRIAL	TELECOM CIRCUIT	85°C	-40°C						Other Telecom ICs	1.23.3V
CAP002DG	Power Integrations	$3.64	RFQ Min: 1 Mult: 1	0x0x0		Integrated Circuit (IC)	Surface Mount		1 (Unlimited)	105°C	-10°C	230V				1.75mm	RoHS Compliant			SOIC	4.9mm		3.9mm			8		540.001716mg	No SVHC	230V		8							No			1		e3	MATTE TIN		DUAL	GULL WING	260		1.27mm	8	OTHER								40																								825V		21.7μA

Specialized ICs(2368)

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