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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Voltage - Rated DC | Current Rating | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Max Frequency | Manufacturer Package Identifier | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Reference Standard | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Element Configuration | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Number of Elements | Subcategory | Power Supplies | Qualification Status | Max Junction Temperature (Tj) | JESD-30 Code | Supplier Device Package | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Turn On Delay Time | Rise Time | Fall Time (Typ) | Turn-Off Delay Time | Continuous Drain Current (ID) | Gate to Source Voltage (Vgs) | Transistor Element Material | Configuration | Case Connection | Transistor Application | Drain to Source Voltage (Vdss) | Architecture | DS Breakdown Voltage-Min | Number of Outputs | Threshold Voltage | Speed | Power Dissipation-Max | JEDEC-95 Code | Number of Registers | Number of Inputs | Number of Gates | Number of Macro Cells | Pulsed Drain Current-Max (IDM) | Drain-source On Resistance-Max | Avalanche Energy Rating (Eas) | Drain to Source Breakdown Voltage | Core Processor | Connectivity | Number of Logic Elements/Cells | FET Type | Input Capacitance (Ciss) (Max) @ Vds | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size | Rds On (Max) @ Id, Vgs | Vgs(th) (Max) @ Id | Current - Continuous Drain (Id) @ 25°C | Gate Charge (Qg) (Max) @ Vgs | Drive Voltage (Max Rds On,Min Rds On) | Vgs (Max) | Module/Board Type | Total RAM Bits |
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| M2S100T-FC1152 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.9mm | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | CAN, Ethernet, I2C, SPI, UART, USART, USB | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S100T | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 574 | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 100K Logic Modules | 99512 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APT1204R7BFLLG | Microsemi |
Min: 1 Mult: 1 |
download | POWER MOS 7® | Through Hole | Through Hole | -55°C~150°C TJ | Tube | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | RoHS Compliant | 1997 | /files/microsemicorporation-aptrg8a120g-datasheets-4026.pdf | 1.2kV | 3.5A | TO-247-3 | 25.96mm | Lead Free | 3 | yes | EAR99 | No | e1 | TIN SILVER COPPER | SINGLE | 3 | 1 | 135W | 1 | 150°C | R-PSFM-T3 | 7 ns | 2ns | 24 ns | 20 ns | 3.5A | 30V | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 1200V | 135W Tc | TO-247AD | 425 mJ | 1.2kV | N-Channel | 715pF @ 25V | 4.7 Ω @ 1.75A, 10V | 5V @ 1mA | 3.5A Tc | 31nC @ 10V | 10V | ±30V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S005S-1TQ144 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 144-LQFP | 20mm | 20mm | 144 | OBSOLETE (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PQFP-G144 | 84 | DDR | 64KB | MCU, FPGA | 84 | 166MHz | 84 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APT5024BLLG | Microsemi |
Min: 1 Mult: 1 |
download | POWER MOS 7® | Through Hole | Through Hole | -55°C~150°C TJ | Tube | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | RoHS Compliant | 1997 | /files/microsemicorporation-apt5024bllg-datasheets-4159.pdf | 500V | 22A | TO-247-3 | Lead Free | 3 | 19 Weeks | No | e1 | TIN SILVER COPPER | SINGLE | 3 | 265W | 1 | R-PSFM-T3 | 8 ns | 6ns | 2 ns | 18 ns | 22A | 30V | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 265W Tc | TO-247AD | 88A | 0.24Ohm | 960 mJ | N-Channel | 1900pF @ 25V | 240m Ω @ 11A, 10V | 5V @ 1mA | 22A Tc | 43nC @ 10V | 10V | ±30V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050S-1FG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | Non-RoHS Compliant | 2016 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 484-BGA | 1.2V | 1.26V | 1.14V | 484 | CAN, Ethernet, I2C, SPI, UART, USART, USB | M2S050S | 484-FPBGA (23x23) | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APT10M11JVRU2 | Microsemi |
Min: 1 Mult: 1 |
download | Chassis Mount, Screw | Chassis Mount | -55°C~150°C TJ | Bulk | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | RoHS Compliant | 2006 | /files/microsemicorporation-apt10m11jvru2-datasheets-1007.pdf | SOT-227-4, miniBLOC | 38.2mm | 9.6mm | 25.4mm | Lead Free | 4 | 36 Weeks | 30.000004g | 4 | yes | EAR99 | AVALANCHE RATED | No | UPPER | UNSPECIFIED | 4 | 1 | Single | 450W | 1 | FET General Purpose Power | 16 ns | 48ns | 9 ns | 51 ns | 142A | 30V | SILICON | ISOLATED | SWITCHING | 100V | 450W Tc | 576A | 2500 mJ | N-Channel | 8600pF @ 25V | 11m Ω @ 71A, 10V | 4V @ 2.5mA | 142A Tc | 300nC @ 10V | 10V | ±30V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050-1VF400 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 166MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 400-LFBGA | 10 Weeks | 400 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S050 | 400-VFBGA (17x17) | 207 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTXV2N6756 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/542 | Through Hole | Through Hole | -55°C~150°C TJ | Bulk | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | Non-RoHS Compliant | 1997 | /files/microsemicorporation-jan2n6758-datasheets-1724.pdf | TO-204AA, TO-3 | 2 | no | EAR99 | RADIATION HARDENED | not_compliant | e0 | Tin/Lead (Sn/Pb) | MIL-19500/542 | BOTTOM | PIN/PEG | NOT SPECIFIED | 2 | NOT SPECIFIED | 1 | FET General Purpose Power | Qualified | O-MBFM-P2 | 14A | SILICON | SINGLE | DRAIN | SWITCHING | 100V | 100V | 4W Ta 75W Tc | 30A | 0.18Ohm | N-Channel | 210m Ω @ 14A, 10V | 4V @ 250μA | 14A Tc | 35nC @ 10V | 10V | ±20V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060T-FG676 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 387 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 387 | 166MHz | 387 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APT40SM120B | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Through Hole | -55°C~175°C TJ | Bulk | 1 (Unlimited) | SiCFET (Silicon Carbide) | ENHANCEMENT MODE | RoHS Compliant | 1997 | /files/microsemicorporation-apt40sm120s-datasheets-7558.pdf | TO-247-3 | 25.96mm | Lead Free | 3 | 22 Weeks | OBSOLETE (Last Updated: 2 weeks ago) | EAR99 | TO-247 (B) | SINGLE | NOT SPECIFIED | 1 | NOT SPECIFIED | 273W | 1 | 175°C | R-PSFM-T3 | 10 ns | 32 ns | 41A | 25V | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 1200V | 1.7V | 273W Tc | 2500 mJ | 1.2kV | N-Channel | 2560pF @ 1000V | 100m Ω @ 20A, 20V | 3V @ 1mA (Typ) | 41A Tc | 130nC @ 20V | 20V | +25V, -10V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050-1FG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 484-BGA | 1.2V | 10 Weeks | 1.26V | 1.14V | 484 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S050 | 484-FPBGA (23x23) | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SK-AX2-CQ256-KITBTM | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2003 | /files/microsemicorporation-lg1272daisychain-datasheets-8022.pdf | Metal | 20 Weeks | No | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050TS-VF400 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.51mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 400-LFBGA | 17mm | 17mm | 400 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B400 | 207 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 207 | 166MHz | 207 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM128CS-ACTEL-1 | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060-1FG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM3F-208PQ-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090TS-FCSG325 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.16mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 13.5mm | 11mm | 325 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | R-PBGA-B325 | 180 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 180 | 166MHz | 180 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SMPA-208CQ-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090TS-FCS325 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.16mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 13.5mm | 11mm | 325 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | R-PBGA-B325 | 180 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 180 | 166MHz | 180 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM208CQSX-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2011 | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090-FGG676 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.44mm | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 676-BGA | 27mm | 27mm | 676 | 11 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S090 | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 425 | 425 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM3F-36UC-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | Hardware | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060-1FGG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SMAX-1272LG-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090T-1FG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.44mm | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S090T | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 267 | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL025-VFG400 | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 1.51mm | RoHS Compliant | 2013 | /files/microsemicorporation-m2s050tfgg484-datasheets-1246.pdf | 400-LFBGA | 17mm | 17mm | 1.2V | 400 | 13 Weeks | 400 | IN PRODUCTION (Last Updated: 3 weeks ago) | yes | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | M2GL025 | 400 | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 195 | 138kB | 207 | 27696 | FIELD PROGRAMMABLE GATE ARRAY | 1130496 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050TS-1FG484M | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 3A001.A.2.C | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGLN250V5-CSG81I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 34μA | RoHS Compliant | 2015 | /files/microsemicorporation-agln010v5ucg36i-datasheets-4103.pdf | 81-WFBGA, CSBGA | 5mm | 800μm | 5mm | 1.5V | 81 | 10 Weeks | 81 | IN PRODUCTION (Last Updated: 1 month ago) | 250MHz | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | NOT SPECIFIED | 1.5V | AGLN250 | NOT SPECIFIED | Not Qualified | 100°C | 60 | FLASH | 4.5kB | 250000 | 2048 | 6144 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-1FCV484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 3.15mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0686.pdf | 484-BFBGA | 19mm | 19mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 273 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 273 | 166MHz | 273 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3PN060-VQG100I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3 nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2mA | RoHS Compliant | 2005 | /files/microsemicorporation-a3pn250vqg100-datasheets-5523.pdf | 100-TQFP | 14mm | 1mm | 14mm | 1.5V | 100 | 8 Weeks | 100 | IN PRODUCTION (Last Updated: 1 month ago) | No | 350MHz | 8542.39.00.01 | 1.425V~1.575V | QUAD | GULL WING | 260 | 1.5V | 0.5mm | A3PN060 | 40 | 71 | 2.3kB | 1536 | 60000 | FIELD PROGRAMMABLE GATE ARRAY | 18432 |
